JPS6130439B2 - - Google Patents

Info

Publication number
JPS6130439B2
JPS6130439B2 JP56156519A JP15651981A JPS6130439B2 JP S6130439 B2 JPS6130439 B2 JP S6130439B2 JP 56156519 A JP56156519 A JP 56156519A JP 15651981 A JP15651981 A JP 15651981A JP S6130439 B2 JPS6130439 B2 JP S6130439B2
Authority
JP
Japan
Prior art keywords
solder
board
small
silver
melting point
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP56156519A
Other languages
English (en)
Japanese (ja)
Other versions
JPS5857785A (ja
Inventor
Kyoshi Sawairi
Kazuo Arisue
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP15651981A priority Critical patent/JPS5857785A/ja
Publication of JPS5857785A publication Critical patent/JPS5857785A/ja
Publication of JPS6130439B2 publication Critical patent/JPS6130439B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Electric Connection Of Electric Components To Printed Circuits (AREA)
JP15651981A 1981-09-30 1981-09-30 電子部品実装方法 Granted JPS5857785A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP15651981A JPS5857785A (ja) 1981-09-30 1981-09-30 電子部品実装方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15651981A JPS5857785A (ja) 1981-09-30 1981-09-30 電子部品実装方法

Publications (2)

Publication Number Publication Date
JPS5857785A JPS5857785A (ja) 1983-04-06
JPS6130439B2 true JPS6130439B2 (en]) 1986-07-14

Family

ID=15629552

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15651981A Granted JPS5857785A (ja) 1981-09-30 1981-09-30 電子部品実装方法

Country Status (1)

Country Link
JP (1) JPS5857785A (en])

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2386080A1 (fr) * 1977-03-31 1978-10-27 Cii Honeywell Bull Systeme de comptabilisation d'unites homogenes predeterminees
FR2403597A1 (fr) * 1977-09-16 1979-04-13 Cii Honeywell Bull Perfectionnements aux systemes de comptabilisation d'unites homogenes predeterminees
FR2455320B1 (fr) * 1979-04-25 1986-01-24 Cii Honeywell Bull Dispositif de recyclage de supports d'enregistrement identifiables a l'aide de donnees d'identification et composes de memoires monolithiques non volatiles effacables
JPS60215277A (ja) * 1984-04-10 1985-10-28 Omron Tateisi Electronics Co カードシステム
JPH0243017U (en]) * 1988-09-16 1990-03-26
JPH0628264A (ja) * 1992-07-10 1994-02-04 Mitsubishi Electric Corp 半導体記憶装置及びそのアクセス方法
US6724554B1 (en) 1995-03-10 2004-04-20 Iomega Corporation Read/write protect scheme for a disk cartridge and drive
JP2561051B2 (ja) * 1995-09-11 1996-12-04 オムロン株式会社 非接触式応答ユニット
JP6668617B2 (ja) * 2015-06-04 2020-03-18 富士電機株式会社 サーミスタ搭載装置およびサーミスタ部品

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS53146169A (en) * 1977-05-25 1978-12-19 Canon Kk Electric circuit board unit
JPS558076A (en) * 1978-07-03 1980-01-21 Mitsubishi Electric Corp Method of manufacturing hybrid ic device

Also Published As

Publication number Publication date
JPS5857785A (ja) 1983-04-06

Similar Documents

Publication Publication Date Title
US4673967A (en) Surface mounted system for leaded semiconductor devices
JPS6130439B2 (en])
JPS5998591A (ja) 両面回路接続方法
JPH0365005B2 (en])
KR100404563B1 (ko) 전자부품, 이 전자부품을 실장한 전자 기기 및 그 제조방법
JP2002185120A (ja) 部品実装基板およびその製造方法
JP3339384B2 (ja) 半田材料並びにプリント配線板及びその製造方法
JPS6464298A (en) Hybrid integrated circuit
JP3436101B2 (ja) 半田材料並びにプリント配線板及びその製造方法
JPH02224393A (ja) 混載実装メタルコアプリント配線基板組立体のはんだ付け方法
JPH04130743A (ja) Ｔａｂ用フイルムキャリアテープ及びそのリードへのはんだ被覆方法
JPS58221667A (ja) チツプ部品の半田付方法
JPH11103164A (ja) 半田材料並びにプリント配線板及びその製造方法
JP2534837B2 (ja) 回路基板への部品の半田付け方法
JP2537630B2 (ja) 半導体装置の製造方法
JPH0446381Y2 (en])
JP2002329738A (ja) 電子部品及びその製造方法
JP2553989Y2 (ja) 電子部品
JPS6235209Y2 (en])
JPS6370597A (ja) 表面実装部品の半田接合方法
JPS61183884A (ja) 電子部品のリ−ド取付方法
JPS61154101A (ja) 電子部品のリ−ド取付方法
JPS5852898A (ja) 印刷配線板への電子部品搭載方法
JPS5916397A (ja) 電子機器用回路装置
JPS6126289A (ja) リ−ドレス部品の印刷配線基板への取付方法